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CVD ALD Atomic Layer Deposition System for Powder Coating Plating
The Thermal Atomic Layer Deposition System is a single-wafer deposition system specially designed for scientific research and small-scale experiments of industrialization. The electric of the system completely accords with the CE criterion. It is widely used in the fields of micro-electronic, nano material, optical film, solar battery etc.
Advanced software controlling system: many functions are integrated in the system, including technological formulation, parameter setting, popedom setting, interlocking alarming and state supervisory control.
| Wafer Dimension | 8 inch and below |
| Wafer temperature | RT-400ºC, Precision ±0.1ºC |
| Number of precursor | Three precursor lines (optional more) |
| Temperature of lines | RT-200ºC, Precision ±0.1ºC |
| Source Bottles Temp | RT-200ºC, Precision ±0.1ºC |
| Background vacuum | <5*10-3 Torr |
| Gas carrier system | N2 or Ar |
| Growing mode | Consecutive or interval deposition mode |
| Controlling system | PLC plus touch screen or display |
| Depositon Heterogeneity | Heterogeneity < ±1% |
| Instrument Dimension | 600mm x 600mm x 1100mm |
